The Digital Partnership, initiated by the Republic of Korea and the European Commission in June 2023, aims to enhance economic resilience through collaborative efforts for an inclusive and robust digital transformation. Key areas of cooperation include semiconductors, High Performance Computing (HPC), Quantum technology, 5G and beyond, platform economy, artificial intelligence (AI), and cybersecurity.
As part of this initiative, a joint call was introduced on February 6, 2024, following the European Chips Act. This call focuses on advancing heterogeneous integration and neuromorphic computing technologies for future semiconductor components and systems to ensure the security of semiconductor device supplies.
The projects under this partnership are expected to yield significant outcomes:
- New materials, process, device, integration and design concepts for neuromorphic computing systems supporting very low energy consumption, connectivity and embedded functions for mobile applications
- Alternative manufacturing process technologies for semiconductor chips including frontend or backend for heterogenous integration. The technologies should sustain in the mid- and long-term the fast paced evolution of device performance, miniaturisation and cost, while reducing the environmental footprint. This includes the process of integrating individually produced chip components into a single assembly level, as well as solutions to streamline and improve this process
- Advanced packaging solutions aiming at heterogeneous integration of multiple functions and materials for applications in AI, communication (RF, mmW or THz), sensing, actuating, power management and active/passive device integration.
The deadline for the FPP Phase is set for 5:00 PM Brussels Time on the 14th of May 2024.
More information and call documents can be found in this link.
